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Semiconductor Underfill

Solution

SY6101D

Performance CharacteristicsGood fluidity at room temperature / Fast curing speed / Excellent reliability / Reworkable
Viscosity (cPs@25℃)300~500
Curing Method8 minutes/130℃
Elongation at Break(%)2.60
Glass Transition Temperature (°C)106

SY6201D

Performance CharacteristicsFirst-level packaging underfill / Fast curing / Reworkable / Excellent heat and cold cycle resistance
Viscosity (cPs@25℃)4,000-7,000
Curing Method10 minutes/150℃
Elongation at Break(%)130
Glass Transition Temperature (℃)25

SY6202D

Performance CharacteristicsSecond-level packaging underfill / Fast flow at room temperature / Bubble-free / Reworkable / Excellent reliability
Viscosity(cPs@25°C)300~600
Curing Method10 minutes/130℃
Elongation at Break(%)108
Glass Transition Temperature (℃)60