Recently, Youxingshark held a grand meeting in the beautiful Zhuhai. Dealer partners from all over the world gathered together to witness Youxingshark's innovative achievements in the field of ...
Underfill is used in the underfill process of Chip Scale Package (CSP) or Ball Array Package (BGA). It can effectively reduce the overall temperature expansion coefficient mismatch between the c...
technical background Underfill, also called underfill, has the functions of reducing the stress impact caused by the difference in thermal expansion coefficient between the chip and the subs...
Foreword Solder joint reliability is crucial Electronic components, which are the core of electronic products, often have to withstand harsh environmental conditions such as temperature cycle...
