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Cell-to-Baseplate & Module-to-Cold Plate Bonding

Solution

Thermally Conductive Structural Adhesive


SY-2971 

Performance CharacteristicsStructural bonding for NEV batteries / Reliable adhesion / Superior vibration & impact resistance / Extreme temperature endurance / Exceptional aging resistance
Thermal Conductivity (W/m·K)1.20
Tensile Shear Strength (MPa)8.0
Volume Resistivity (Ω·cm)1.0×10^16
Work Time50


Liquid Cooling Plate Integration


SY-2434 

Performance CharacteristicsSuperior elasticity, paintable surface / Exceptional aging resistance / Eco-friendly formula / Ideal for bonding and sealing metals and plastics
Tensile Shear Strength (MPa)≥2.50(AL/AL)
Elongation at Break≥450%
Tack-Free Time40-60min
Hardness (Shore D)50