Chip packaging is an important link in the semiconductor manufacturing
process. It refers to the packaging of bare chips into a form that can be used
in electronic devices. This process is to protect the chip from the effects of
the surrounding environment (including physical and chemical effects), ensure
that the chip can be reliably connected to external circuits, and provide
necessary thermal management. Therefore, chip packaging materials need to have
the characteristics of high and low temperature resistance, high dielectric
strength, good insulation, and low stress.
Youxing Shark Chip
Packaging Solutions
Youxingsha provides adhesives required for level 0, level 1, and level 2
chip packaging, including COB encapsulation adhesive, board-level underfill
adhesive, flip-chip encapsulation adhesive, FPC component protection adhesive,
etc.
COB encapsulating glue
1161
Application
points
Chip encapsulation protects IC and chips
Features
● High purity, low CTE, low shrinkage
●High Tg, high temperature resistance, good reflowability
● High reliability
Board level underfill
glue 1162
Application
points
BGA and CSP chip solder joint filling
Features
●Ultra-low viscosity, fast flow, good filling effect
●High Tg, high temperature resistance
● Low CTE, low stress, small deformation
Flip chip packaging
adhesive 1163
Application
points
Flip chip with underfill
Features
● Low CTE, good heat resistance, high reliability
● Good rheological properties and high purity
● Balanced performance, good toughness, reduced warpage and certain
structural strength.
FPC component protection
glue 1164
Application
points
QFN component protection on FPC
Features
● Low temperature curing
● Good leveling properties
●Easy to repair
● Low halogen
Youxingsha focuses on the research, development and application of
adhesives in integrated circuits and semiconductors, smart terminals, new energy
and other industries. Our professional R&D team is committed to providing
customers with customized adhesive solutions, aiming to help customers reduce
costs and increase efficiency, improve product reliability and durability, and
enhance the brand value of customers' final products.
