Chip packaging is an important link in the semiconductor manufacturing process. It refers to the packaging of bare chips into a form that can be used in electronic devices. This process is to protect the chip from the effects of the surrounding environment (including physical and chemical effects), ensure that the chip can be reliably connected to external circuits, and provide necessary thermal management. Therefore, chip packaging materials need to have the characteristics of high and low temperature resistance, high dielectric strength, good insulation, and low stress.

　　Youxing Shark Chip Packaging Solutions

　　Youxingsha provides adhesives required for level 0, level 1, and level 2 chip packaging, including COB encapsulation adhesive, board-level underfill adhesive, flip-chip encapsulation adhesive, FPC component protection adhesive, etc.

　　COB encapsulating glue 1161

　　　Application points

　　Chip encapsulation protects IC and chips

　　Features

　　● High purity, low CTE, low shrinkage

　　●High Tg, high temperature resistance, good reflowability

　　● High reliability

　　Board level underfill glue 1162

　　Application points

　　BGA and CSP chip solder joint filling

　　Features

　　●Ultra-low viscosity, fast flow, good filling effect

　　●High Tg, high temperature resistance

　　● Low CTE, low stress, small deformation

　　Flip chip packaging adhesive 1163

　　Application points

　　Flip chip with underfill

　　Features

　　● Low CTE, good heat resistance, high reliability

　　● Good rheological properties and high purity

　　● Balanced performance, good toughness, reduced warpage and certain structural strength.

　　FPC component protection glue 1164

　　Application points

　　QFN component protection on FPC

　　Features

　　● Low temperature curing

　　● Good leveling properties

　　●Easy to repair

　　● Low halogen

　　Youxingsha focuses on the research, development and application of adhesives in integrated circuits and semiconductors, smart terminals, new energy and other industries. Our professional R&D team is committed to providing customers with customized adhesive solutions, aiming to help customers reduce costs and increase efficiency, improve product reliability and durability, and enhance the brand value of customers' final products.